Encapsulation
SOP(1)
Packaging
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  • Brand: Yamaichi
    Encapsulation: SOP
    Description: SOP testing, pre burned socket small form factor packaging testing, and solder on sockets can test devices during operation. The top is an open type, low force socket. Main Material Polyetherimide (PEI) Glass Filled Beryllium Copper Joint Contact Electroplating Nickel Gold Plating Flammability UL 94 V-0 Insulation Resistance 1000M Ω Contact Resistance 30M Ω (under 10mA conditions) Spacing 1.27mm Operating Temperature -40 ° C to 150 ° C # # IC Socket Yamaichi Testing and Pre firing
    3046
    1+
    $111.1130
    10+
    $106.2820
    100+
    $105.4124
    250+
    $104.7361
    500+
    $103.6733
    1000+
    $103.1902
    2500+
    $102.5138
    5000+
    $101.9341

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